Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate

Product Details
Customization: Available
Al2O3: 99.7~99.9%
Application: Semiconductors
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  • Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate
  • Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate
  • Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate
  • Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate
  • Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate
  • Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate
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Basic Info.

Model NO.
Chemshun Ceramics
Transport Package
Carton + Wooden Box
Specification
Within D850mm, thickness 45mm.
Trademark
Chemshun Ceramics
Origin
China
HS Code
6909191200
Production Capacity
500pic /Month

Product Description

Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate

Pingxiang Chemshun Ceramics Co.,ltd's High Purity 99.7%Alumina Ceramics Disc as Sapphire Lapping Wafer Polishing Plate Turn Table



Description: 

Chemshun Ceramics' alumina ceramics sapphire lapping wafer polishing is shaped as PIBM producing process. Its an internaltional  advanced technology.  PIBM sucessful solve the key problem of crack and deformation of large size alumina ceramics.PIBM technology will open another window of fine ceramics.

Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate


Application:

Pingxiang Chemshun Ceramics' High Purity 99.7% Alumina Ceramic Sapphire Lapping wafer Polishing Turn Table as an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapphire and Wafer. Because of the high purity alumina ceramics polishing plate excellent working performance, it is replacing the Metal wafer polishing plate. 




Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate


Chemshun Alumina Ceramic Polishing Plate, Lapping Ceramic Disc Features :  

High Purity Alumina
High rigidity (Hardness, Mechanical Strength, Flexural Strength, Wear Resistance)
High chemical durability
Surface shape & roughness control
For Wide Variation of wafer size & Thickness 
Ability to Resist the Severe Microchip-processing equipment environment
High Quality & Pretty Price Compare to Japane Alumina Polishing Plate



Size:

Disc, ring size below ∅850mm, thickness 45mm.
For example: D150mm, D360mm, D450MM D600mm.
Customized products with various size are accepted.


Main Parameter : (Chemical / physical):
 
    Unit Chemshun 99.7 Alumina Ceramics
General Properties Al2O3 content wt% 99.7-99.9
Density gm/cc 3.94-3.97
Color - Ivory
Water absorption % 0
Mechanical Properties Flexural Strength(MOR) 20 ºC Mpa(psix10^3) 440-550
Elastic Modulus 20ºC GPa (psix10^6) 375
Vickers Hardness Gpa(kg/mm2) R45N >=17
Bending Strength Gpa 390
Tensile Strength 25ºC MPa(psix10^3) 248
Fracture Toughness (K I c) Mpa* m^1/2 4-5
Thermal Properities Thermal conductivity(20ºC) W/mk 30
Coefficient of Thermal expansion(25-1000ºC) 1x 10^-6/ºC 7.6
Thermal Shock Resistance ºC 200
Maximum use temperature ºC 1700
Electrical Properities Dielectric Strength (1MHz) ac-kv/mm(ac v/mil) 8.7
Dielectric Constant(1 MHz) 25ºC 9.7
Volume Resistivity ohm-cm (25ºC) >10^14
ohm-cm (500ºC) 2x10^12
ohm-cm (1000ºC) 2x10^7


Chemshun Ceramics High Purity 99.7% Alumina Ceramic Sapphire Polishing Turn Table widely used in the semiconductors manufacturing equipment. We not only produce the high quality alumina ceramic wafer polishing plate, but also other series of large size high purity alumina ceramics such as 1200x500x20mm ceramic substrates for LCD manufacturing equipment, semiconductor delviery tracks, vacuum parts, general mechanical parts, bulletproof ceramics.  For more information, welcome to direclty contact with us.

Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate


Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate

Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate


Chemical Mechanical Polishing (CMP) 99.7% Alumina Ceramic Wafer Polishing Plate
 

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