High Alumina Ceramic Wafer Polishing Plate for Chemical Mechanical Polishing (CMP)

• Customization: Available
• Transport Package: Carton or Wooden Box
• Specification: size below ∅ 850mm, thickness 45mm.
• Model NO.: Chemshun Ceramic
• Trademark: Chemshun Ceramics
• Origin: China
• HS Code: 6909191200
• Production Capacity: 500pic /Month

Product Description

High Alumina Ceramic Wafer Polishing Plate for Chemical Mechanical Polishing (CMP) 

Application:

Pingxiang Chemshun Ceramics' High Purity 99.7% Alumina Ceramic Sapphire Polishing Turn Table As an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapphire and Wafer.







Features :  
High rigidity (Hardness, Mechanical Strength, Wear Resistance)
High chemical durability
Surface shape & roughness control
Pretty Price

Size:
Disc, ring size below ∅850mm, thickness 45mm.
For example: D150mm, D360mm, D450MM D600mm.
Customized products with various size are accepted.

Main Parameter : (Chemical / physical):
 

Property	Unit	Chemshun Product
Density	g/cm^3	3.94-3.97
Al2O3	%	99.7-99.9
Vickers hardness	GPa	>=17
Three-point bending strength	MPa	440-550
Thermal Diffusion Coefficient	Cm^2/S	0.0968
Modulus of Elasticity	Gpa	356

  

Chemshun Ceramics High Purity 99.7% Alumina Ceramic Sapphire Polishing Turn Table widely used in the semiconductors manufacturing equipment. For more information, welcome to direclty contact with us.