Chemshun Alumina Ceramic Wafer Polishing Plate

• Customization: Available
• Type: Disc Grinder
• Power Source: Chemical Mechanical Polishing
• Model NO.: Chemshun Ceramic
• Object: Wafer
• Application: Semiconductor
• Disc(Wheel) Type: Polishing Plate
• Material: Alumina Ceramics
• Working Style: Chemical Mechanical Polishing
• Disc Diameter: Within 850mm
• Transport Package: Carton and Wooden Box
• Specification: size below ∅ 850mm, thickness 45mm.
• Trademark: Chemshun Ceramics
• Origin: China
• HS Code: 6909191200
• Production Capacity: 500pic /Month

Product Description

Chemshun Alumina Ceramic Wafer Polishing Plate

99.7% Alumina Wafer Polishing Plate / Turn Table



>>> Application:

Chemshun Ceramics 99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing. As an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapphire and Wafer of the semiconductors. 

Chemshun Ceramics' high purity 99.7 % alumina ceramics sapphire polishing and  lapping plates, Disc are shaped as PIBM producing process. Its an internaltional  advanced technology.  PIBM sucessful solve the key problem of crack and deformation of large size alumina ceramics.PIBM technology will open another window of fine ceramics.

>>> The Process Photo of CMP:





>>> Features of Chemshun Ceramics 997 Alumina Ceramic Polishing Plate :  

High Purity Alumina
High rigidity (Hardness, Mechanical Strength, Flexural Strength, Wear Resistance)
High chemical durability
Surface shape & roughness control
For Wide Variation of wafer size & Thickness 
Ability to Resist the Severe Microchip-processing equipment environment
High Quality & Pretty Price Compare to Japane Alumina Polishing Plate


>>> Size:

Disc, ring size below ∅850mm, thickness 45mm.
For example: D150mm, D360mm,D 600mm.
Customized products with various size are accepted.

>>> Main Parameter : 
 

		Unit	Chemshun 99.7 Alumina Ceramics
General Properties	Al2O3 content	wt%	99.7-99.9
	Density	gm/cc	3.94-3.97
	Color	-	Ivory
	Water absorption	%	0
Mechanical Properties	Flexural Strength(MOR) 20 ºC	Mpa(psix10^3)	440-550
	Elastic Modulus 20ºC	GPa (psix10^6)	375
	Vickers Hardness	Gpa(kg/mm2) R45N	>=17
	Bending Strength	Gpa	390
	Tensile Strength 25ºC	MPa(psix10^3)	248
	Fracture Toughness (K I c)	Mpa* m^1/2	4-5
Thermal Properities	Thermal conductivity(20ºC)	W/mk	30
	Coefficient of Thermal expansion(25-1000ºC)	1x 10^-6/ºC	7.6
	Thermal Shock Resistance	ºC	200
	Maximum use temperature	ºC	1700
Electrical Properities	Dielectric Strength (1MHz)	ac-kv/mm(ac v/mil)	8.7
	Dielectric Constant(1 MHz)	25ºC	9.7
	Volume Resistivity	ohm-cm (25ºC)	>10^14
		ohm-cm (500ºC)	2x10^12
		ohm-cm (1000ºC)	2x10^7