Bonding Function: | High Temperature Resistant Adhesive |
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Morphology: | Water-Soluble |
Application: | Construction |
Material: | Epoxy |
Classification: | Room Curing |
Main Agent Composition: | Inorganic Adhesive Material |
Samples: |
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Customization: |
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Color |
A |
White |
B |
Pale yellow |
|
A:B |
1:01 |
|
Density (g/cc) |
1.4 |
|
Physical status |
Soupy |
|
Operating time (minute/25ºC) |
40 |
|
Solidifying (25ºC) |
24hours |
|
Shear Strength (Mpa) |
20 |
|
Tensile Strength (Mpa) |
65 |
|
Working temperature ºC |
-60~150 |
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