Alumina Ceramic Wafer Polishing Plates Are Used in Chemical Mechanical Polishing (CMP)

• Customization: Available
• Al2O3: 99.7~99.9%
• Application: Semiconductors
• Model NO.: Chemshun Ceramic
• Specification: Within D850mm, thickness 45mm.
• Trademark: Chemshun Ceramics
• Origin: China
• HS Code: 6909191200
• Production Capacity: 500pic /Month

Product Description

Alumina ceramic wafer polishing plates are used in Chemical Mechanical Polishing (CMP)

Description: 

Chemshun Ceramics' alumina ceramics sapphire lapping wafer polishing is shaped as PIBM producing process. Its an internaltional  advanced technology.  PIBM sucessful solve the key problem of crack and deformation of large size alumina ceramics.PIBM technology will open another window of fine ceramics. We not only produce the high quality alumina ceramic wafer polishing plate, but also other series of large size high purity alumina ceramics such as 1200x500x20mm ceramic substrates for LCD manufacturing equipment, semiconductor delviery tracks, vacuum parts, general mechanical parts, bulletproof ceramics. 



Application:

Pingxiang Chemshun Ceramics' High Purity 99.7% Alumina Ceramic Sapphire Lapping wafer Polishing Turn Table as an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapphire and Wafer. Because of the high purity alumina ceramics polishing plate excellent working performance, it is replacing the Metal wafer polishing plate. 







Features :  

High rigidity (Hardness, Mechanical Strength, Wear Resistance)
High chemical durability
Surface shape & roughness control
Pretty Price

Size:

Disc, ring size below ∅850mm, thickness 45mm.
For example: D150mm, D360mm, D450MM D600mm.
Customized products with various size are accepted.

Main Parameter : (Chemical / physical):
 

		Unit	Chemshun 99.7 Alumina Ceramics
General Properties	Al2O3 content	wt%	99.7-99.9
	Density	gm/cc	3.94-3.97
	Color	-	Ivory
	Water absorption	%	0
Mechanical Properties	Flexural Strength(MOR) 20 ºC	Mpa(psix10^3)	440-550
	Elastic Modulus 20ºC	GPa (psix10^6)	375
	Vickers Hardness	Gpa(kg/mm2) R45N	>=17
	Bending Strength	Gpa	390
	Tensile Strength 25ºC	MPa(psix10^3)	248
	Fracture Toughness (K I c)	Mpa* m^1/2	4-5
Thermal Properities	Thermal conductivity(20ºC)	W/mk	30
	Coefficient of Thermal expansion(25-1000ºC)	1x 10^-6/ºC	7.6
	Thermal Shock Resistance	ºC	200
	Maximum use temperature	ºC	1700
Electrical Properities	Dielectric Strength (1MHz)	ac-kv/mm(ac v/mil)	8.7
	Dielectric Constant(1 MHz)	25ºC	9.7
	Volume Resistivity	ohm-cm (25ºC)	>10^14
		ohm-cm (500ºC)	2x10^12
		ohm-cm (1000ºC)	2x10^7

Chemshun Ceramics High Purity 99.7% Alumina Ceramic Sapphire Polishing Turn Table widely used in the semiconductors manufacturing equipment. For more information, welcome to direclty contact with us.