99.7alumina Ceramic Polishing Plate for Semiconductor

Product Details
Customization: Available
Type: Disc Grinder
Power Source: Chemical Mechanical Polishing
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  • 99.7alumina Ceramic Polishing Plate for Semiconductor
  • 99.7alumina Ceramic Polishing Plate for Semiconductor
  • 99.7alumina Ceramic Polishing Plate for Semiconductor
  • 99.7alumina Ceramic Polishing Plate for Semiconductor
  • 99.7alumina Ceramic Polishing Plate for Semiconductor
  • 99.7alumina Ceramic Polishing Plate for Semiconductor
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Basic Info.

Model NO.
Chemshun Ceramic
Object
Wafer
Application
Semiconductor
Disc(Wheel) Type
Polishing Plate
Material
Alumina Ceramics
Working Style
Chemical Mechanical Polishing
Disc Diameter
Within 850mm
Transport Package
Carton and Wooden Box
Specification
size below ∅ 850mm, thickness 45mm.
Trademark
Chemshun Ceramics
Origin
China
HS Code
6909191200
Production Capacity
500pic /Month

Product Description

99.7alumina Ceramic Polishing Plate for Semiconductor

99.7% Alumina Wafer Polishing Plate / Turn Table


99.7alumina Ceramic Polishing Plate for Semiconductor

>>> Application:

Chemshun Ceramics 99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing. As an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapphire and Wafer of the semiconductors. 

Chemshun Ceramics' high purity 99.7 % alumina ceramics sapphire polishing and  lapping plates, Disc are shaped as PIBM producing process. Its an internaltional  advanced technology.  PIBM sucessful solve the key problem of crack and deformation of large size alumina ceramics.PIBM technology will open another window of fine ceramics.

>>> The Process Photo of CMP:


99.7alumina Ceramic Polishing Plate for Semiconductor


>>> Features of Chemshun Ceramics 997 Alumina Ceramic Polishing Plate :  

High Purity Alumina
High rigidity (Hardness, Mechanical Strength, Flexural Strength, Wear Resistance)
High chemical durability
Surface shape & roughness control
For Wide Variation of wafer size & Thickness 
Ability to Resist the Severe Microchip-processing equipment environment
High Quality & Pretty Price Compare to Japane Alumina Polishing Plate


>>> Size:

Disc, ring size below ∅850mm, thickness 45mm.
For example: D150mm, D360mm,D 600mm.
Customized products with various size are accepted.


>>> Main Parameter : 
 
    Unit Chemshun 99.7 Alumina Ceramics
General Properties Al2O3 content wt% 99.7-99.9
Density gm/cc 3.94-3.97
Color - Ivory
Water absorption % 0
Mechanical Properties Flexural Strength(MOR) 20 ºC Mpa(psix10^3) 440-550
Elastic Modulus 20ºC GPa (psix10^6) 375
Vickers Hardness Gpa(kg/mm2) R45N >=17
Bending Strength Gpa 390
Tensile Strength 25ºC MPa(psix10^3) 248
Fracture Toughness (K I c) Mpa* m^1/2 4-5
Thermal Properities Thermal conductivity(20ºC) W/mk 30
Coefficient of Thermal expansion(25-1000ºC) 1x 10^-6/ºC 7.6
Thermal Shock Resistance ºC 200
Maximum use temperature ºC 1700
Electrical Properities Dielectric Strength (1MHz) ac-kv/mm(ac v/mil) 8.7
Dielectric Constant(1 MHz) 25ºC 9.7
Volume Resistivity ohm-cm (25ºC) >10^14
ohm-cm (500ºC) 2x10^12
ohm-cm (1000ºC) 2x10^7


  

99.7alumina Ceramic Polishing Plate for Semiconductor


99.7alumina Ceramic Polishing Plate for Semiconductor
99.7alumina Ceramic Polishing Plate for Semiconductor
99.7alumina Ceramic Polishing Plate for Semiconductor
 

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